Creep behavior of SnAgCu solders with rare earth Ce doping

ZHANGLiang(张亮),XUESong-bai(薛松柏),GAOLi-li(皋利利),ZENGGuang(曾广),CHENYan(陈燕),YUSheng-lin(禹胜林),

Transactions of Nonferrous Metals Society of China ›› 2010, Vol. 20 ›› Issue (03) : 412-417.

The Nonferrous Metals Society of China
Transactions of Nonferrous Metals Society of China ›› 2010, Vol. 20 ›› Issue (03) : 412-417.
Functional Materials

Creep behavior of SnAgCu solders with rare earth Ce doping

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{{article.zuoZheEn_L}}. {{article.title_en}}[J]. {{journal.qiKanMingCheng_EN}}, 2010, 20(03): 412-417

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