Interfacial reactions between Sn-2.5Ag-2.0Ni solder and electroless Ni(P) deposited on SiCp/Al composites

WUMao(吴茂),QUXuan-hui(曲选辉),HEXin-bo(何新波),Rafi-ud-din,RENShu-bin(任淑彬),QINMing-li(秦明礼)

Transactions of Nonferrous Metals Society of China ›› 2010, Vol. 20 ›› Issue (06) : 958-965.

The Nonferrous Metals Society of China
Transactions of Nonferrous Metals Society of China ›› 2010, Vol. 20 ›› Issue (06) : 958-965.
Structural Materials

Interfacial reactions between Sn-2.5Ag-2.0Ni solder and electroless Ni(P) deposited on SiCp/Al composites

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{{article.zuoZheEn_L}}. {{article.title_en}}[J]. {{journal.qiKanMingCheng_EN}}, 2010, 20(06): 958-965

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