Influences of diffusion bonding process parameters on bond characteristics of Mg-Cu dissimilar joints
G.MAHENDRAN,V.BALASUBRAMANIAN,T.SENTHILVELAN
Transactions of Nonferrous Metals Society of China ›› 2010, Vol. 20 ›› Issue (06) : 997-1005.
Influences of diffusion bonding process parameters on bond characteristics of Mg-Cu dissimilar joints
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