Influences of diffusion bonding process parameters on bond characteristics of Mg-Cu dissimilar joints

G.MAHENDRAN,V.BALASUBRAMANIAN,T.SENTHILVELAN

Transactions of Nonferrous Metals Society of China ›› 2010, Vol. 20 ›› Issue (06) : 997-1005.

Transactions of Nonferrous Metals Society of China ›› 2010, Vol. 20 ›› Issue (06) : 997-1005.
Structural Materials

Influences of diffusion bonding process parameters on bond characteristics of Mg-Cu dissimilar joints

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{{article.zuoZheEn_L}}. {{article.title_en}}[J]. {{journal.qiKanMingCheng_EN}}, 2010, 20(06): 997-1005

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