Numerical simulation on thixoforging of electronic packaging shell with SiCp/A356 composites

WANGKai-kun(王开坤),WANGFu-yu(汪富玉),CHENXue-jun(陈学军),WANGLu(王璐),MAChun-mei(马春梅)

Transactions of Nonferrous Metals Society of China ›› 2010, Vol. 20 ›› Issue (09) : 1707-1711.

The Nonferrous Metals Society of China
Transactions of Nonferrous Metals Society of China ›› 2010, Vol. 20 ›› Issue (09) : 1707-1711.
Rheology, Modelling and Simulation

Numerical simulation on thixoforging of electronic packaging shell with SiCp/A356 composites

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{{article.zuoZheEn_L}}. {{article.title_en}}[J]. {{journal.qiKanMingCheng_EN}}, 2010, 20(09): 1707-1711

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