Microstructure and deposition mechanism of
electrodeposited Cu/liquid microcapsule composite

XU Xiu-qing, ZHU Li-qun, LI Wei-ping, LIU Hui-cong

Transactions of Nonferrous Metals Society of China ›› 2011, Vol. 21 ›› Issue (10) : 2210-2215.

The Nonferrous Metals Society of China
Transactions of Nonferrous Metals Society of China ›› 2011, Vol. 21 ›› Issue (10) : 2210-2215.
Functional Materials

Microstructure and deposition mechanism of
electrodeposited Cu/liquid microcapsule composite

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{{article.zuoZheEn_L}}. {{article.title_en}}[J]. {{journal.qiKanMingCheng_EN}}, 2011, 21(10): 2210-2215

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