Atomistic simulation of thermal effects and defect structures during nanomachining of copper

GUO Yong-bo, LIANG Ying-chun

Transactions of Nonferrous Metals Society of China ›› 2012, Vol. 22 ›› Issue (11) : 2762-2770.

Transactions of Nonferrous Metals Society of China ›› 2012, Vol. 22 ›› Issue (11) : 2762-2770.
Computational Materials Science and Numerical Mode

Atomistic simulation of thermal effects and defect structures during nanomachining of copper

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{{article.zuoZheEn_L}}. {{article.title_en}}[J]. {{journal.qiKanMingCheng_EN}}, 2012, 22(11): 2762-2770

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