Nanogrinding of SiC wafers with high flatness and low subsurface damage

HUO Feng-wei, GUO Dong-ming, KANG Ren-ke, FENG Guang

Transactions of Nonferrous Metals Society of China ›› 2012, Vol. 22 ›› Issue (12) : 3027-3033.

The Nonferrous Metals Society of China
Transactions of Nonferrous Metals Society of China ›› 2012, Vol. 22 ›› Issue (12) : 3027-3033.
Functional Materials

Nanogrinding of SiC wafers with high flatness and low subsurface damage

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{{article.zuoZheEn_L}}. {{article.title_en}}[J]. {{journal.qiKanMingCheng_EN}}, 2012, 22(12): 3027-3033

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