Microstructure characterization and thermal properties of hypereutectic Si-Al alloy for electronic packaging applications

YUKun,LIShao-jun,CHENLi-san,ZHAOWei-shang,LIPeng-fei

Transactions of Nonferrous Metals Society of China ›› 2012, Vol. 22 ›› Issue (6) : 1412-1417.

The Nonferrous Metals Society of China
Transactions of Nonferrous Metals Society of China ›› 2012, Vol. 22 ›› Issue (6) : 1412-1417.
功能材料-Functional Materials

Microstructure characterization and thermal properties of hypereutectic Si-Al alloy for electronic packaging applications

  • {{article.zuoZhe_EN}}
Author information +
History +

HeighLight

{{article.keyPoints_en}}

Abstract

{{article.zhaiyao_en}}

Key words

QR code of this article

Cite this article

EndNote

Ris (Procite)

Bibtex

Download Citations
{{article.zuoZheEn_L}}. {{article.title_en}}[J]. {{journal.qiKanMingCheng_EN}}, 2012, 22(6): 1412-1417

References

List( Publishing order | Descend order by publishing year | Descend order by cited within ) Chart analysis

References

{{article.reference}}

Funding

RIGHTS & PERMISSIONS

{{article.copyrightStatement_en}}
{{article.copyrightLicense_en}}

Accesses

Citation

Detail
Sections
Recommended
Superintended by The China Association for Science and Technology (CAST)
Sponsored by The Nonferrous Metals Society of China (NFSOC)
Managed by Central South University (CSU)
Add: Central South University, Changsha 410083, China
Tel: +86-731-88876765 or +86-731-88877197
Fax: +86-731-88877197
E-mail: f-ysxb@mail.csu.edu.cn
Wechat ID
Copyright © Editorial Office of Transactions of Nonferrous Metals Society of China    湘ICP备09001153号-9

/

〈 〉