Microstructure and properties of Al/Si/SiC composites for electronic packaging
ZHU Xiao-min, YU Jia-kang, WANG Xin-yu
Transactions of Nonferrous Metals Society of China ›› 2012, Vol. 22 ›› Issue (7) : 1686-1692.
Microstructure and properties of Al/Si/SiC composites for electronic packaging
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