Interfacial characteristics and microstructural evolution of Sn-6.5Zn solder/Cu substrate joints during aging
ZHAO Guo-ji, SHENG Guang-min, WU Li-li, YUAN Xin-jian
Transactions of Nonferrous Metals Society of China ›› 2012, Vol. 22 ›› Issue (8) : 1954-1960.
Interfacial characteristics and microstructural evolution of Sn-6.5Zn solder/Cu substrate joints during aging
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