Interfacial characteristics and microstructural evolution of Sn-6.5Zn solder/Cu substrate joints during aging

ZHAO Guo-ji, SHENG Guang-min, WU Li-li, YUAN Xin-jian

Transactions of Nonferrous Metals Society of China ›› 2012, Vol. 22 ›› Issue (8) : 1954-1960.

Transactions of Nonferrous Metals Society of China ›› 2012, Vol. 22 ›› Issue (8) : 1954-1960.
结构材料-Structural Materials

Interfacial characteristics and microstructural evolution of Sn-6.5Zn solder/Cu substrate joints during aging

  • {{article.zuoZhe_EN}}
Author information +
History +

HeighLight

{{article.keyPoints_en}}

Abstract

{{article.zhaiyao_en}}

Key words

QR code of this article

Cite this article

Download Citations
{{article.zuoZheEn_L}}. {{article.title_en}}[J]. {{journal.qiKanMingCheng_EN}}, 2012, 22(8): 1954-1960

References

References

{{article.reference}}

Funding

RIGHTS & PERMISSIONS

{{article.copyrightStatement_en}}
{{article.copyrightLicense_en}}

Accesses

Citation

Detail

Sections
Recommended

/