Laser-assisted deposition of Cu bumps for microelectronic packaging

Won-SeokCHOI,JoohanKIM

Transactions of Nonferrous Metals Society of China ›› 2012, Vol. 22 ›› Issue (Special 3) : 683-687.

The Nonferrous Metals Society of China
Transactions of Nonferrous Metals Society of China ›› 2012, Vol. 22 ›› Issue (Special 3) : 683-687.
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Laser-assisted deposition of Cu bumps for microelectronic packaging

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{{article.zuoZheEn_L}}. {{article.title_en}}[J]. {{journal.qiKanMingCheng_EN}}, 2012, 22(Special 3): 683-687

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