Microstructure and properties of electronic packaging box with high silicon aluminum-base alloy by semi-solid thixoforming

Qi-jinJIA,Jun-youLIU,Yan-xiaLI,Wen-shaoWANG

Transactions of Nonferrous Metals Society of China ›› 2013, Vol. 23 ›› Issue (1) : 80-85.

PDF(1325 KB)
The Nonferrous Metals Society of China
PDF(1325 KB)
Transactions of Nonferrous Metals Society of China ›› 2013, Vol. 23 ›› Issue (1) : 80-85.
Structural Materials

Microstructure and properties of electronic packaging box with high silicon aluminum-base alloy by semi-solid thixoforming

  • {{article.zuoZhe_EN}}
Author information +
History +

HeighLight

{{article.keyPoints_en}}

Abstract

{{article.zhaiyao_en}}

Key words

QR code of this article

Cite this article

EndNote

Ris (Procite)

Bibtex

Download Citations
{{article.zuoZheEn_L}}. {{article.title_en}}[J]. {{journal.qiKanMingCheng_EN}}, 2013, 23(1): 80-85

References

List( Publishing order | Descend order by publishing year | Descend order by cited within ) Chart analysis

References

{{article.reference}}

Funding

RIGHTS & PERMISSIONS

{{article.copyrightStatement_en}}
{{article.copyrightLicense_en}}
PDF(1325 KB)

Accesses

Citation

Detail
Sections
Recommended
Superintended by The China Association for Science and Technology (CAST)
Sponsored by The Nonferrous Metals Society of China (NFSOC)
Managed by Central South University (CSU)
Add: Central South University, Changsha 410083, China
Tel: +86-731-88876765 or +86-731-88877197
Fax: +86-731-88877197
E-mail: f-ysxb@mail.csu.edu.cn
Wechat ID
Copyright © Editorial Office of Transactions of Nonferrous Metals Society of China    湘ICP备09001153号-9

/

〈 〉