Dilute H2SO4 solution for copper seed cleaning in electroplating

Youn-SeoungLEE,Jae-SikYOON,Yang-RaeJO,HeesooLEE,Sa-KyunRHA

Transactions of Nonferrous Metals Society of China ›› 2013, Vol. 23 ›› Issue (2) : 562-566.

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The Nonferrous Metals Society of China
PDF(636 KB)
Transactions of Nonferrous Metals Society of China ›› 2013, Vol. 23 ›› Issue (2) : 562-566.
Mine Engineering, Metallurgical Engineering, Chemistry and Chemical Engineering

Dilute H2SO4 solution for copper seed cleaning in electroplating

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{{article.zuoZheEn_L}}. {{article.title_en}}[J]. {{journal.qiKanMingCheng_EN}}, 2013, 23(2): 562-566

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