Laser-weldable Sip-SiCp/Al hybrid composites with bilayer structure for electronic packaging
Meng-jian ZHU, Shun LI, Xun ZHAO, De-gan XIONG
Transactions of Nonferrous Metals Society of China ›› 2014, Vol. 24 ›› Issue (4) : 1032-1038.
Laser-weldable Sip-SiCp/Al hybrid composites with bilayer structure for electronic packaging
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