Laser-weldable Sip-SiCp/Al hybrid composites with bilayer structure for electronic packaging

Meng-jian ZHU, Shun LI, Xun ZHAO, De-gan XIONG

Transactions of Nonferrous Metals Society of China ›› 2014, Vol. 24 ›› Issue (4) : 1032-1038.

Transactions of Nonferrous Metals Society of China ›› 2014, Vol. 24 ›› Issue (4) : 1032-1038.
Functional Materials

Laser-weldable Sip-SiCp/Al hybrid composites with bilayer structure for electronic packaging

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{{article.zuoZheEn_L}}. {{article.title_en}}[J]. {{journal.qiKanMingCheng_EN}}, 2014, 24(4): 1032-1038

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