Electromigration induced microstructure evolution and damage in asymmetric Cu/Sn-58Bi/Cu solder interconnect under current stressing

WuYUE,Hong-boQIN,Min-boZHOU,XiaoMA,Xin-pingZHANG

Transactions of Nonferrous Metals Society of China ›› 2014, Vol. 24 ›› Issue (5) : 1619-1628.

The Nonferrous Metals Society of China
Transactions of Nonferrous Metals Society of China ›› 2014, Vol. 24 ›› Issue (5) : 1619-1628.
Mine Engineering, Metallurgical Engineering, Chemistry and Chemical Engineering

Electromigration induced microstructure evolution and damage in asymmetric Cu/Sn-58Bi/Cu solder interconnect under current stressing

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{{article.zuoZheEn_L}}. {{article.title_en}}[J]. {{journal.qiKanMingCheng_EN}}, 2014, 24(5): 1619-1628

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