Effect of temperature on interface diffusion in micro solder joint under current stressing

Xue-mei LI, Feng-lian SUN, Hao ZHANG, Tong XIN

Transactions of Nonferrous Metals Society of China ›› 2015, Vol. 25 ›› Issue (5) : 1699-1703.

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The Nonferrous Metals Society of China
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Transactions of Nonferrous Metals Society of China ›› 2015, Vol. 25 ›› Issue (5) : 1699-1703.
Mine Engineering, Metallurgical Engineering, Chemistry and Chemical Engineering

Effect of temperature on interface diffusion in micro solder joint under current stressing

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{{article.zuoZheEn_L}}. {{article.title_en}}[J]. {{journal.qiKanMingCheng_EN}}, 2015, 25(5): 1699-1703

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