Microstructures and properties of Al-50%SiC composites for electronic packaging applications

FeiTENG,KunYU,JieLUO,Hong-jieFANG,Chun-liSHI,Yi-longDAI,Han-qingXIONG

Transactions of Nonferrous Metals Society of China ›› 2016, Vol. 26 ›› Issue (10) : 2647-2652.

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Transactions of Nonferrous Metals Society of China ›› 2016, Vol. 26 ›› Issue (10) : 2647-2652.
Functional Materials

Microstructures and properties of Al-50%SiC composites for electronic packaging applications

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{{article.zuoZheEn_L}}. {{article.title_en}}[J]. {{journal.qiKanMingCheng_EN}}, 2016, 26(10): 2647-2652

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