Drop failure modes of Sn-3.0Ag-0.5Cu solder joints in wafer level chip scale package

Ming-liangHUANG,NingZHAO,ShuangLIU,Yi-qianHE

Transactions of Nonferrous Metals Society of China ›› 2016, Vol. 26 ›› Issue (6) : 1663-1669.

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Transactions of Nonferrous Metals Society of China ›› 2016, Vol. 26 ›› Issue (6) : 1663-1669.
Functional Materials

Drop failure modes of Sn-3.0Ag-0.5Cu solder joints in wafer level chip scale package

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{{article.zuoZheEn_L}}. {{article.title_en}}[J]. {{journal.qiKanMingCheng_EN}}, 2016, 26(6): 1663-1669

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