Growth behavior and microstructure of intermetallics at interface of AuSn20 solder and metalized-Ni layer

Xiao-fengWEI,Xue-weiZHU,Ri-chuWANG

Transactions of Nonferrous Metals Society of China ›› 2017, Vol. 27 ›› Issue (5) : 1199-1205.

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The Nonferrous Metals Society of China
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Transactions of Nonferrous Metals Society of China ›› 2017, Vol. 27 ›› Issue (5) : 1199-1205.
Mine Engineering, Metallurgical Engineering, Chemistry and Chemical Engineering

Growth behavior and microstructure of intermetallics at interface of AuSn20 solder and metalized-Ni layer

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{{article.zuoZheEn_L}}. {{article.title_en}}[J]. {{journal.qiKanMingCheng_EN}}, 2017, 27(5): 1199-1205

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