Direct active soldering of Al0.3CrFe1.5MnNi0.5 high entropy alloy to 6061-Al using Sn-Ag-Ti active solder

L. C. TSAO, S. Y. CHANG, Y. C. YU

Transactions of Nonferrous Metals Society of China ›› 2018, Vol. 28 ›› Issue (4) : 748-756.

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The Nonferrous Metals Society of China
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Transactions of Nonferrous Metals Society of China ›› 2018, Vol. 28 ›› Issue (4) : 748-756.
Functional Materials

Direct active soldering of Al0.3CrFe1.5MnNi0.5 high entropy alloy to 6061-Al using Sn-Ag-Ti active solder

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{{article.zuoZheEn_L}}. {{article.title_en}}[J]. {{journal.qiKanMingCheng_EN}}, 2018, 28(4): 748-756

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