Property alterations of Sn-0.6Cu-0.05Ni-Ge lead-free solder by Ag, Bi, In and Sb addition

Kannachai KANLAYASIRI, Rachata KONGCHAYASUKAWAT

Transactions of Nonferrous Metals Society of China ›› 2018, Vol. 28 ›› Issue (6) : 1166-1175.

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Transactions of Nonferrous Metals Society of China ›› 2018, Vol. 28 ›› Issue (6) : 1166-1175.
Functional Materials

Property alterations of Sn-0.6Cu-0.05Ni-Ge lead-free solder by Ag, Bi, In and Sb addition

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{{article.zuoZheEn_L}}. {{article.title_en}}[J]. {{journal.qiKanMingCheng_EN}}, 2018, 28(6): 1166-1175

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