Microstructure and residual stress of TiN films deposited at low temperature by arc ion plating

Hai-juanMEI,Sheng-shengZHAO,WeiCHEN,Qi-minWANG,Hai-fengLIANG

Transactions of Nonferrous Metals Society of China ›› 2018, Vol. 28 ›› Issue (7) : 1368-1376.

PDF(2920 KB)
PDF(2920 KB)
Transactions of Nonferrous Metals Society of China ›› 2018, Vol. 28 ›› Issue (7) : 1368-1376.
Functional Materials

Microstructure and residual stress of TiN films deposited at low temperature by arc ion plating

  • {{article.zuoZhe_EN}}
Author information +
History +

HeighLight

{{article.keyPoints_en}}

Abstract

{{article.zhaiyao_en}}

Key words

QR code of this article

Cite this article

Download Citations
{{article.zuoZheEn_L}}. {{article.title_en}}[J]. {{journal.qiKanMingCheng_EN}}, 2018, 28(7): 1368-1376

References

References

{{article.reference}}

Funding

RIGHTS & PERMISSIONS

{{article.copyrightStatement_en}}
{{article.copyrightLicense_en}}
PDF(2920 KB)

Accesses

Citation

Detail

Sections
Recommended

/