Effects of Ag contents in Sn–xAg lead-free solders on microstructure, corrosion behavior and interfacial reaction with Cu substrate

Phacharaphon TUNTHAWIROON, Kannachai KANLAYASIRI

Transactions of Nonferrous Metals Society of China ›› 2019, Vol. 29 ›› Issue (8) : 1696-1704.

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The Nonferrous Metals Society of China
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Transactions of Nonferrous Metals Society of China ›› 2019, Vol. 29 ›› Issue (8) : 1696-1704.
Materials Science and Engineering

Effects of Ag contents in Sn–xAg lead-free solders on microstructure, corrosion behavior and interfacial reaction with Cu substrate

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{{article.zuoZheEn_L}}. {{article.title_en}}[J]. {{journal.qiKanMingCheng_EN}}, 2019, 29(8): 1696-1704

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