Die sinter bonding in air using copper formate preform for formation of full-density bondline

Yun-Ju LEE, Jong-Hyun LEE

Transactions of Nonferrous Metals Society of China ›› 2021, Vol. 31 ›› Issue (6) : 1717-1728.

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Transactions of Nonferrous Metals Society of China ›› 2021, Vol. 31 ›› Issue (6) : 1717-1728.
Materials Science and Engineering

Die sinter bonding in air using copper formate preform for formation of full-density bondline

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{{article.zuoZheEn_L}}. {{article.title_en}}[J]. {{journal.qiKanMingCheng_EN}}, 2021, 31(6): 1717-1728

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