Growth kinetics of interfacial intermetallic compounds formed in SnPbInBiSb high entropy alloy soldered joints on Cu substrates

Shuai WANG, Jia-yun FENG, Wei WANG, Wen-chao CAO, Xin DING, Shang WANG, Yan-hong TIAN

Transactions of Nonferrous Metals Society of China ›› 2024, Vol. 34 ›› Issue (11) : 3650-3661.

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Transactions of Nonferrous Metals Society of China ›› 2024, Vol. 34 ›› Issue (11) : 3650-3661.
Materials Science and Engineering

Growth kinetics of interfacial intermetallic compounds formed in SnPbInBiSb high entropy alloy soldered joints on Cu substrates

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{{article.zuoZheEn_L}}. {{article.title_en}}[J]. {{journal.qiKanMingCheng_EN}}, 2024, 34(11): 3650-3661

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