The effects of trace addition of Al₂O₃ nanoparticles (NPs) on thermal reliabilities of Sn-0.5Ag-0.7Cu/Cu solder joints were investigated. Experimental results showed that trace addition of Al₂O₃ NPs could increase the isotheraml aging (IA) and thermal cyclic (TC) lifetimes of Sn-0.5Ag-0.7Cu/Cu joint from 662 to 787 h, and from 1597 to 1824 cycles, respectively. Also, trace addition of Al₂O₃ NPs could slow down the shear force reduction of solder joint during thermal services, which was attributed to the pinning effect of Al₂O₃ NPs on hindering the growth of grains and interfacial intermetallic compounds (IMCs). Theoretically, the growth coefficients of interfacial IMCs in IA process were calculated to be decreased from 1.61×10^-10 to 0.79×10^-10 cm²/h in IA process, and from 0.92×10^-10 to 0.53×10^-10 cm²/h in TC process. This indicated that trace addition of Al₂O₃ NPs can improve both IA and TC reliabilities of Sn-0.5Ag- 0.7Cu/Cu joint, and a little more obvious in IA reliability.