Materials Science and Engineering

Stress analysis and microstructure evolution of Cu/Al composite plate during corrugated rolling

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  • Yan-xiao LIU1, Yuan-ming LIU1,2,3, Zhen-hua WANG1,2,3, Yan-ping LIU1, Tao WANG1,2,3, Qing-xue HUANG1,2,3
1. College of Mechanical and Vehicle Engineering, Taiyuan University of Technology, Taiyuan 030024, China;
2. Engineering Research Center of Advanced Metal Composites Forming Technology and Equipment, Ministry of Education, Taiyuan University of Technology, Taiyuan 030024, China;
3. TYUT-UOW Joint Research Center, Taiyuan University of Technology, Taiyuan 030024, China

Online published: 2023-05-25

Abstract

A 3D finite element model was developed. The accuracy of the model was verified through a rolling experiment in which the reduction rate of the plate was 50%. The metal flow law in the rolling process was analyzed from the perspective of time during the whole corrugated rolling process. The deformation experienced by all metal particles is divided into two periods: the filling period and the extension period. The stress change is complex during the filling period, but the stress change trend is approximate during the extension period. The stress state of characteristic positions is two tensile stresses and one compressive stress when the plate starts to deform, which was analyzed by the Lode angle parameter and triaxiality parameter. The microstructure evolution of the Cu plate was analyzed using electron backscatter diffraction (EBSD) technology. Compared with the initial plate, grain refinement occurs at each characteristic position of the Cu plate. There is a phenomenon of grain growth at the trough of the Cu plate after refinement due to the adiabatic temperature increase caused by severe plastic deformation.

Cite this article

Yan-xiaoLIU,Yuan-mingLIU,Zhen-huaWANG,Yan-pingLIU,TaoWANG,Qing-xueHUANG, . Stress analysis and microstructure evolution of Cu/Al composite plate during corrugated rolling[J]. Transactions of Nonferrous Metals Society of China, 2023 , 33(5) : 1460 -1471 . DOI: 10.1016/S1003-6326(23)66196-5

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