To improve the strength of Al alloys without severely deteriorating the thermal conductivity, the Cu/Al bimetallic composite comprising penetration architecture was artificially designed and fabricated via the additive manufacturing combined with the squeeze casting. The composite exhibited a good balance of the strength (~340 MPa) and thermal conductivity (200 W/(m·K)), outperforming the traditional Al alloys. High thermal conduction is attributed to the geometrical Cu scaffold, which provides a rapid pathway for the electron conduction. Simultaneously, the good metallurgical bonding is attained by the formation of the Al₂Cu eutectic phase along the interfaces, which effectively enhances the strength of the Cu/Al composite.