Mining, Minerals Processing and Metallurgical Engineering

Sn nucleation and growth from Sn(II) dissolved in ethylene glycol: Electrochemical behavior and temperature effect

  • Kiem Van DO ,
  • Hieu Van NGUYEN ,
  • Tu Manh LE
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  • 1. Faculty of Electrical and Electronic Engineering, Phenikaa University, Yen Nghia, Ha-Dong, Hanoi 10000, Vietnam;
    2. Phenikaa Research and Technology Institute (PRATI), A&A Green Phoenix Group, 167 Hoang Ngan, Hanoi 10000, Vietnam;
    3. Faculty of Materials Science and Engineering, Phenikaa Institute for Advanced Study (PIAS), Phenikaa University, Hanoi 10000, Vietnam

Online published: 2025-11-04

Abstract

Thermodynamic and kinetic aspects of Sn nucleation and growth processes onto a glassy carbon electrode from SnCl2·2H2O dissolved in ethylene glycol solutions were studied. Typical reduction and oxidation peaks observed in voltammograms have demonstrated the capability of ethylene glycol solutions to electrodeposit Sn. The temperature-dependence of diffusion coefficient values derived from potentiodynamic and potentiostatic studies helped to determine and validate estimations of the activation energy for Sn(II) bulk diffusion. Chronoamperometric results have identified that, the suitable model to describe the early stage of Sn electrodeposition could be composed of Sn three-dimensional nucleation and diffusion-controlled growth and water reduction contributions, which was duly validated by theoretical and experimental approaches. From the model, typical kinetic parameters such as the nucleation frequency of Sn (A), number density of Sn nuclei (N0), and diffusion coefficient of Sn(II) ions (D), were determined. The presence of Sn nuclei with excellent quality and their structures were verified using SEM, EDX, and XRD techniques.

Cite this article

Kiem Van DO , Hieu Van NGUYEN , Tu Manh LE . Sn nucleation and growth from Sn(II) dissolved in ethylene glycol: Electrochemical behavior and temperature effect[J]. Transactions of Nonferrous Metals Society of China, 2024 , 34(8) : 2714 -2732 . DOI: 10.1016/S1003-6326(24)66571-4

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