The corrosion behavior and life of Sn-3.0Ag-0.5Cu solder joints were investigated through fire smoke exposure experiments within the temperature range of 45-80 °C. The nonlinear Wiener process and Arrhenius equation were used to establish the probability distribution function and prediction model of the solder joint’s average life and individual remaining useful life. The results indicate that solder joint resistance shows a nonlinear growth trend with time increasing. After 24 h, the solder joint transforms from spherical to rose-like shapes. Higher temperatures accelerate solder joint failure, and the relationship between failure time and temperature conforms to the Arrhenius equation. The predicted life of the model is in good agreement with experimental results, demonstrating the effectiveness and accuracy of the model.