The effects of trace cerium (Ce) addition on the microstructural and textural evolution and the dynamic recrystallization (DRX) of the ultrahigh-purity copper (Cu) containing small amounts of sulfur (S) were investigated using a Gleeble-1500 thermal simulation tester at 600 °C. The results show that with increasing Ce content, the grain size of the Cu-S (S2) alloy gradually decreases and the grain boundary embrittlement induced by S impurities is considerably inhibited. The addition of Ce promotes the DRX process of the S2 alloy and changes its DRX mechanism from discontinuous to continuous and twinning-induced DRX mechanisms. The texture component and intensity of the S2 alloy vary with the increase of Ce content. The addition of 120×10^-6 Ce (mass fraction) is favorable for the grain orientation randomization, which is attributed to the promoted DRX.