Al/Cu laminate composite was fabricated based on hot press sintering using Cu sheet and Al powders as raw materials. The effects of sintering parameters on interfacial structure and mechanical properties were investigated. The results revealed that a uniform Al/Cu interface with excellent bonding quality was achieved. The thickness of intermetallic compounds (IMCs) reached 33.88 μm after sintering at 620 °C for 2 h, whereas it was only 14.88 μm when sintered at 600 °C for 1 h. AlCu phase was developed through the reaction between Al₄Cu₉ and Al₂Cu with prolonging sintering time, and an amorphous oxide strip formed at AlCu/Al₄Cu₉ interface. Both the grain morphology and interfacial structure affected the tensile strength of Al/Cu laminate, whereas the mode of tensile fracture strongly relied on the interfacial bonding strength. The highest tensile strength of 151.1 MPa and bonding strength of 93.7 MPa were achieved after sintering at 600 °C for 1 h.