The Nonferrous Metals Society of China
Microstructure and electric properties of Sip/Al composites for
 electronic packaging applications
XIUZi-yang(修子扬),WUGao-hui(武高辉),ZHANGQiang(张 强),SONGMei-hui(宋美慧),TIANShou-fu(田首夫)
Transactions of Nonferrous Metals Society of China . 2007, (Special 1): 1034 -1038 . 

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