The Nonferrous Metals Society of China
Microstructures and properties of Sn-Ag-Cu lead-free
 solder alloys containing La
ZHOUYing-chun(周迎春),PANQing-lin(潘清林),HEYun-bin(何运斌),LIANGWen-jie(梁文杰)LIWen-bin(李文斌),LIYun-chun(李运春),LUCong-ge(路聪阁)
Transactions of Nonferrous Metals Society of China . 2007, (Special 1): 1043 -1048 . 

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