Numerical simulation on thixoforging of electronic packaging shell with SiC<SUB>p</SUB>/A356 composites

Numerical simulation on thixoforging of electronic packaging shell with SiC_p/A356 composites

WANGKai-kun(王开坤),WANGFu-yu(汪富玉),CHENXue-jun(陈学军),WANGLu(王璐),MAChun-mei(马春梅)

Transactions of Nonferrous Metals Society of China . 2010, (09): 1707 -1711 .

Superintended by The China Association for Science and Technology (CAST)
Sponsored by The Nonferrous Metals Society of China (NFSOC)
Managed by Central South University (CSU)

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