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TNMSC at ELSEVIER
Influence of Cu content on microstructure, grain orientation and mechanical properties of Sn-xCu lead-free solders
KannachaiKANLAYASIRI,NiwatMOOKAM
Transactions of Nonferrous Metals Society of China . 2022, (
4
): 1226 -1241 . DOI: 10.1016/S1003-6326(22)65869-2